![[Information] Solutions for the 5G Communication Industry](https://image.www.ipros.com/public/product/image/469/2000815590/IPROS48929840179257526276.png?w=280&h=280)
[Information] Solutions for the 5G Communication Industry
Enriching today's and tomorrow's lives! Providing solutions to the 5G communication industry!
Our company offers a variety of components suitable for copper-clad laminates (CCL) and flexible copper-clad laminates (FCCL) that enhance the 5G compatibility of printed circuit boards (PCBs). This document features numerous products, including "POLYVEST," which is effective in improving resin, and "COMPIMIDE Bismaleimide," which is effective in thermal resistance. The rapidly advancing 5G technology worldwide enhances satisfaction in society and the economy and can be applied in various forms. We encourage you to read on. 【Featured Products (Partial)】 <Effect: Thermal Resistance> ■COMPIMIDE Bismaleimide ■IDISIL Colloidal Silica Particles <Effect: Dielectric Performance> ■AEROSIL Fumed Silica <Effect: Antenna Reinforcement> ■ROHACELL *For more details, please refer to the PDF document or feel free to contact us.
- 企業：エボニック ジャパン
- 価格：Other
